YOLOv8 for Defect Inspection of Hexagonal Directed Self-Assembly Patterns: A Data-Centric Approach
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Abstract (arXiv)
Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.
Key facts. Cited by 5 papers in the map (data through 7 Oct 2026). Builds on 10 of its 31 references that are in the map. First posted on arXiv 28 Jul 2023.
Builds on
10 of 31 references.
References · 10
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Citing papers per year: 2023: 1; 2024: 3; 2025: 1.
5 papers.
- 2024Addressing Class Imbalance and Data Limitations in Advanced Node Semiconductor Defect Inspection: A Generative Approach for SEM Imagescited by 5
- 2023Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategycited by 2
- 2024Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAScited by 2
- 2024An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspectioncited by 0
- 2025A Multi-Camera Vision-Based Approach for Fine-Grained Assembly Quality Controlcited by 0
- 2025A Multi-Camera Vision-Based Approach for Fine-Grained Assembly Quality Control28 Sep 2025
- 2024An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection17 Jul 2024
- 2024Addressing Class Imbalance and Data Limitations in Advanced Node Semiconductor Defect Inspection: A Generative Approach for SEM Images14 Jul 2024
- 2024Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS8 Apr 2024
- 2023Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy19 Nov 2023