# LDU-Bench: Multimodal LLM Evaluation for Lithography Defect Understanding under Layout-Varying Circuit Backgrounds

arXiv: https://arxiv.org/abs/2608.03078 · HTML: https://mlsanity.com/paper/2608.03078/

## Key facts

- No citing papers in the map yet (data through 14 Oct 2026).
- Builds on 10 of its 24 references that are in the map.
- First posted on arXiv 4 Aug 2026.

## Builds on (most cited first, 10 of 10)

- [Learning Transferable Visual Models From Natural Language Supervision](https://mlsanity.com/paper/2103.00020/) (2021)
- [Kosmos-2: Grounding Multimodal Large Language Models to the World](https://mlsanity.com/paper/2306.14824/) (2023)
- [Shikra: Unleashing Multimodal LLM's Referential Dialogue Magic](https://mlsanity.com/paper/2306.15195/) (2023)
- [PaDiM: a Patch Distribution Modeling Framework for Anomaly Detection and Localization](https://mlsanity.com/paper/2011.08785/) (2020)
- [DRAEM -- A discriminatively trained reconstruction embedding for surface anomaly detection](https://mlsanity.com/paper/2108.07610/) (2021)
- [Ferret: Refer and Ground Anything Anywhere at Any Granularity](https://mlsanity.com/paper/2310.07704/) (2023)
- [EfficientAD: Accurate Visual Anomaly Detection at Millisecond-Level Latencies](https://mlsanity.com/paper/2303.14535/) (2023)
- [Deep Learning based Defect classification and detection in SEM images: A Mask R-CNN approach](https://mlsanity.com/paper/2211.02185/) (2022)
- [SEMI-CenterNet: A Machine Learning Facilitated Approach for Semiconductor Defect Inspection](https://mlsanity.com/paper/2308.07180/) (2023)
- [Scanning Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review](https://mlsanity.com/paper/2409.06833/) (2024)

## Abstract (arXiv)

Multimodal large language models have demonstrated strong defect recognition capability in industrial anomaly detection. However, in lithography review, merely determining whether an image contains a defect is insufficient for engineering inspection; models must also understand defect morphology, spatial location, and the potential causes supported by visible evidence. To this end, this paper proposes LDU-Bench, a multi-task multimodal benchmark for lithography defect understanding. Constructed from real lithography and integrated-circuit review images, LDU-Bench decomposes the review workflow into four independent tasks: defect triage, morphology recognition, coarse localization, and image-conditioned cause analysis. It systematically evaluates models using task-level metrics, diagnostic readouts, and the Lithography Closure Score (LCS). Experimental results show that although existing MLLMs can perform defect triage relatively reliably, this ability does not stably transfer to downstream review stages. Morphology alignment, effective localization, and evidence-to-cause mapping remain the major bottlenecks. Further diagnostics indicate that this capability break is not a fluctuation of a single metric, but reflects insufficient structured understanding across semantic levels. Overall, LDU-Bench provides a quantifiable and diagnostic unified platform for evaluating the usability, failure points, and capability boundaries of industrial MLLMs in lithography review chains.