# IoT-Enhanced CNN-Based Labelled Crack Detection for Additive Manufacturing Image Annotation in Industry 4.0

arXiv: https://arxiv.org/abs/2604.22857 · HTML: https://mlsanity.com/paper/2604.22857/

## Key facts

- No citing papers in the map yet (data through 14 Oct 2026).
- Builds on 1 of its 56 references that are in the map.
- First posted on arXiv 22 Apr 2026.

## Builds on (most cited first, 1 of 1)

- [Digital Twins in Additive Manufacturing: A Systematic Review](https://mlsanity.com/paper/2409.00877/) (2024)

## Abstract (arXiv)

This paper presents an IoT-enhanced deep learning framework for automated crack detection in Additive Manufacturing (AM) surfaces using convolutional neural networks (CNNs). By integrating IoT-enabled real-time monitoring, high-resolution imaging, and edge computing, the system enables continuous in-situ defect detection and classification. Real-time data acquisition supports immediate CNN-based analysis, improving both accuracy and efficiency in AM quality control. The framework supports supervised and semi-supervised learning, enabling robust performance on large, sparsely annotated datasets. Using LabelImg for annotation and OpenCV for preprocessing, the system achieves 99.54% accuracy on 14,982 images, with 96% precision, 98% recall, and a 97% F1-score. Dataset balancing and augmentation significantly improve generalization, increasing accuracy from 32% to 99%. Beyond detection, the framework establishes a linkage between AM process parameters, defect formation, and surface topology, supporting predictive analytics and defect mitigation. Aligned with Industry 4.0, it incorporates Digital Twin (DT) technology for real-time process simulation, predictive maintenance, and adaptive control. Key contributions include an IoT-based monitoring system using edge devices (Raspberry Pi 4B), an optimized CNN with model quantization and batch processing reducing inference latency by 47%, and an MQTT-based low-latency data streaming system with 5G connectivity, lowering transmission overhead by 35%. DT integration further enables predictive defect analysis and dynamic adjustment of AM parameters. This work advances intelligent AM quality control by providing a scalable, high-accuracy, and low-latency framework. Future directions include multimodal data fusion, hybrid architectures, and enhanced Digital Twin simulations for AI-driven defect prevention.