# Generative Design for Direct-to-Chip Liquid Cooling for Data Centers

arXiv: https://arxiv.org/abs/2604.10941 · HTML: https://mlsanity.com/paper/2604.10941/

## Key facts

- No citing papers in the map yet (data through 14 Oct 2026).
- Builds on 1 of its 15 references that are in the map.
- First posted on arXiv 13 Apr 2026.

## Builds on (most cited first, 1 of 1)

- [Cooling-Guide Diffusion Model for Battery Cell Arrangement](https://mlsanity.com/paper/2403.10566/) (2024)

## Abstract (arXiv)

Rapid growth in artificial intelligence (AI) workloads is driving up data center power densities, increasing the need for advanced thermal management. Direct-to-chip liquid cooling can remove heat efficiently at the source, but many cold plate channel layouts remain heuristic and are not optimized for the strongly non-uniform temperature distribution of modern heterogeneous packages. This work presents a generative design framework for synthesizing cooling channel geometries for the NVIDIA GB200 Grace Blackwell Superchip. A physics-based finite-difference thermal model provides rapid steady-state temperature predictions and supplies spatial thermal feedback to a constrained reaction-diffusion process that generates novel channel topologies while enforcing inlet/outlet and component constraints. By iterating channel generation and thermal evaluation in a closed loop, the method naturally redistributes cooling capacity toward high-power regions and suppresses hot-spot formation. Compared with a baseline parallel channel design, the resulting channels achieve more than a 5 degree Celsius reduction in average temperature and over 35 degree Celsius reduction in maximum temperature. Overall, the results demonstrate that coupling generative algorithms with lightweight physics-based modeling can significantly enhance direct-to-chip liquid cooling performance, supporting more sustainable scaling of AI computing.