# Wafer-Level Etch Spatial Profiling for Process Monitoring from Time-Series with Time-LLM

arXiv: https://arxiv.org/abs/2603.23576 · HTML: https://mlsanity.com/paper/2603.23576/

## Key facts

- No citing papers in the map yet (data through 14 Oct 2026).
- Builds on 7 of its 15 references that are in the map.
- First posted on arXiv 24 Mar 2026.

## Builds on (most cited first, 7 of 7)

- [Chronos: Learning the Language of Time Series](https://mlsanity.com/paper/2403.07815/) (2024)
- [Time-LLM: Time Series Forecasting by Reprogramming Large Language Models](https://mlsanity.com/paper/2310.01728/) (2023)
- [One Fits All:Power General Time Series Analysis by Pretrained LM](https://mlsanity.com/paper/2302.11939/) (2023)
- [Large Language Models Are Zero-Shot Time Series Forecasters](https://mlsanity.com/paper/2310.07820/) (2023)
- [LLM4TS: Aligning Pre-Trained LLMs as Data-Efficient Time-Series Forecasters](https://mlsanity.com/paper/2308.08469/) (2023)
- [Predicting Time-to-Failure of Plasma Etching Equipment using Machine Learning](https://mlsanity.com/paper/1904.07686/) (2019)
- [Data-driven surrogate model for etch rate profiles using sensor data from a reactive ion etcher](https://mlsanity.com/paper/2409.12925/) (2024)

## Abstract (arXiv)

Understanding wafer-level spatial variations from in-situ process signals is essential for advanced plasma etching process monitoring. While most data-driven approaches focus on scalar indicators such as average etch rate, actual process quality is determined by complex two-dimensional spatial distributions across the wafer. This paper presents a spatial regression model that predicts wafer-level etch depth distributions directly from multichannel in-situ process time series. We propose a Time-LLM-based spatial regression model that extends LLM reprogramming from conventional time-series forecasting to wafer-level spatial estimation by redesigning the input embedding and output projection. Using the BOSCH plasma-etching dataset, we demonstrate stable performance under data-limited conditions, supporting the feasibility of LLM-based reprogramming for wafer-level spatial monitoring.