# Combining unsupervised and supervised learning in microscopy enables defect analysis of a full 4H-SiC wafer

arXiv: https://arxiv.org/abs/2402.13353 · HTML: https://mlsanity.com/paper/2402.13353/

## Key facts

- No citing papers in the map yet (data through 14 Oct 2026).
- Builds on 13 of its 45 references that are in the map.
- First posted on arXiv 20 Feb 2024.

## Builds on (most cited first, 13 of 13)

- [Deep Residual Learning for Image Recognition](https://mlsanity.com/paper/1512.03385/) (2015)
- [Very Deep Convolutional Networks for Large-Scale Image Recognition](https://mlsanity.com/paper/1409.1556/) (2014)
- [Faster R-CNN: Towards Real-Time Object Detection with Region Proposal Networks](https://mlsanity.com/paper/1506.01497/) (2015)
- [ImageNet Large Scale Visual Recognition Challenge](https://mlsanity.com/paper/1409.0575/) (2014)
- [Mask R-CNN](https://mlsanity.com/paper/1703.06870/) (2017)
- [EfficientNet: Rethinking Model Scaling for Convolutional Neural Networks](https://mlsanity.com/paper/1905.11946/) (2019)
- [UMAP: Uniform Manifold Approximation and Projection for Dimension Reduction](https://mlsanity.com/paper/1802.03426/) (2018)
- [Training Deep Networks with Synthetic Data: Bridging the Reality Gap by Domain Randomization](https://mlsanity.com/paper/1804.06516/) (2018)
- [Accelerated Hierarchical Density Clustering](https://mlsanity.com/paper/1705.07321/) (2017)
- [Data-driven discovery of novel 2D materials by deep generative models](https://mlsanity.com/paper/2206.12159/) (2022)
- [Accelerating Materials Development via Automation, Machine Learning, and High-Performance Computing](https://mlsanity.com/paper/1803.11246/) (2018)
- [A deep learned nanowire segmentation model using synthetic data augmentation](https://mlsanity.com/paper/2109.04429/) (2021)
- [Deep Learning of Crystalline Defects from TEM images: A Solution for the Problem of "Never Enough Training Data"](https://mlsanity.com/paper/2307.06322/) (2023)

## Abstract (arXiv)

Detecting and analyzing various defect types in semiconductor materials is an important prerequisite for understanding the underlying mechanisms as well as tailoring the production processes. Analysis of microscopy images that reveal defects typically requires image analysis tasks such as segmentation and object detection. With the permanently increasing amount of data that is produced by experiments, handling these tasks manually becomes more and more impossible. In this work, we combine various image analysis and data mining techniques for creating a robust and accurate, automated image analysis pipeline. This allows for extracting the type and position of all defects in a microscopy image of a KOH-etched 4H-SiC wafer that was stitched together from approximately 40,000 individual images.