# Stack up your chips: Betting on 3D integration to augment Moore's Law scaling

arXiv: https://arxiv.org/abs/2005.10866 · HTML: https://mlsanity.com/paper/2005.10866/

## Key facts

- Cited by 1 papers in the map (data through 14 Oct 2026).
- First posted on arXiv 21 May 2020.

## Built on by (most cited first, 1 of 1)

- [A Case for 3D Integrated System Design for Neuromorphic Computing & AI Applications](https://mlsanity.com/paper/2103.04852/) (2021)

## Abstract (arXiv)

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.